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A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The electronics industry, in recent years, has been focusing primarily on product miniaturization and lead-free assembly. The need for product miniaturization is due to the continuous demand for ...
A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three dimensional (3D) integration offers numerous electrical advantages like shorter interconnection distances between different dies in the stack, reduced signal delay, reduced interconnect power ...